Overview of ICPIAM

The 2nd International Conference on Physical Instrumentation and Advanced Materials (ICPIAM  2019) aimed to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results about all aspects of the contemporary concerns, methods and approaches to instrumentation and materials. It also provides the premier interdisciplinary forum for researchers, practitioners and educators to present and discuss the most recent innovations, trends, concerns, practical challenges encountered and the solutions adopted in the field of Instrumentation and Materials.

Time Event

  • Last date for abstract submission : 22 June 2019
  • Early Bird Registration Deadline : 22 August 2019
  •  Full-Text Paper Submission Deadline : 22 August2019

2nd  International Conference on Physical Instrumentation and Advanced Materials will be held on 22 October, 2019 in  Grand Dafam Hotel


Keynote Speakers

Prof. Dr. Eng, Seiichi Ozawa, Kobe University, Japan

Prof. Dr. Gunther Andersson, Flinders University, South Australia

Prof. Dr. Ir. Nicolas Gascoin,Head of the Cooperation Office for Science & Technology – Ambassade de France en Indonésie

Dr. Suryani Dyah Astuti, Airlangga University, Indonesia

Invited Speakers

Prof. Dr. Sulaiman W. Harun, University of Malaya, Malaysia

Dr. Auro Perego, Aston University, UK

Dr.Andi Hamim Zaidan, S.Si., M.Si., Airlangga University, Indonesia

Febdian Rusydi, S.T., M. Sc. Ph.D., Airlangga University, Indonesia

Dr. rer. Nat. Aulia Nasution, Institut Teknologi Sepuluh Nopember (ITS), Indonesia

Prof. Dr. Eng. Setyawan P. Sakti, Brawijaya University, Indonesia

Topics of Paper

Biomaterials & Biotechnology
Metals and alloys for advanced applications
Advanced Composite Materials
Electrical/Magnetic Materials
Coatings and Surface Engineering
Computational Materials Science
New Functional Materials
Optical and Photonic Materials
Nanomaterials & Nanotechnology
Graphene, Carbon nanotubes and related materials
Polymer and soft materials
Advances in Tomography: Sensor design, Instrumentation, Image Reconstruction algorithms and Measurement
Instrumentation and measurement for improving quality, reliability and safety
Wearable and Implantable Wireless Sensor
Advanced Measurement and Data Processing for Complex Engineering System
Measurements for emerging power systems
Related Emerging Areas